工藝技術(shù)
鋁基板制程能力
線路板層數(shù) 1、2、4 Layers | 孔徑誤差值 NPTH:±0.05mm (± 2mils) Hole Size Tolerance PTH:±0.075mm (± 3mils) |
最小線經(jīng)/線距(H/H) 0.1mm (4mils) Min. Trace/Space (H/H) | 最小SMD間距/墊寬 0.2mm (8mils) Min. SMD Space/ Land Width |
最小線經(jīng)/線距(1/1 2/2) 0.15mm (6mils) Min. Trace/Space(1/1 2/2) | 最大板尺寸 400mmx1500mm (16"x59") Max. Panel Size |
最小孔經(jīng) 0.2mm (8mils) Min. Hole Size (Before Plating) | 薄板能力 0.4mm (16mils) Min. Thickness Board |
防焊誤差值 0.05mm (2.0mils) Solder Mask Tolerance | 厚板能力 3.0mm (118mils) Max. Heavy Board |
防焊條 0.1mm (4mils) Min. Solder Dam | 成型尺寸精度 ± 0.15mm (±6mils) Outline Dimension Tolerance |
表面處理:OSP、無(wú)鉛噴錫、化銀、化錫、鍍(化)金 Sunface Treatment :OSP、Lead Free HAL、Immersion Ag、Immersion Sn、Plating (Immersion)Gold | |